7628 Prepreg 4.4

3313 Perpreg 4.1

2116 Perpreg 4.16

FR4(1-layer): 606 × 510 mm

FR4(2-layer): 670 × 600 mm

FR4(4-layer): 663 × 593 mm

FR4(6-layer and above): 656 × 586 mm

Rogers / PTFE Teflon PCB: 590 × 438 mm

Aluminum PCB: 602 × 506 mm

Copper PCB: 480 × 286 mm

These limits apply to PCBs with thickness ≥ 0.8 mm. The thinner FR4 PCBs are 599 × 497 mm maximum.

2-layer FR4 PCBs can reach a maximum size of 1020 × 600 mm.

4-layer FR4 PCBs can reach a maximum size of 1016 × 596 mm.

FR4/Rogers/PTFE: 3 × 3 mm

Castellated / Plated Edges: 10 × 10 mm

Aluminum/Copper PCB: 5 × 5 mm

2-layer: 1 oz / 2 oz / 2.5 oz / 3.5 oz / 4.5oz

Multi-layer: 1 oz / 2 oz

Aluminum PCBs: HASL only; FR-4/HDI boards with 6 or more layers, boards with a thickness ≤ 0.4 mm, high-frequency boards, copper-based PCBs, and FPCs do not support HASL.

1-layer: 0.3 – 6.3 mm

2-layer: 0.15 – 6.3 mm

Multilayer: 0.15 – 6.3 mm

Holes with diameter ≥ 6.3 mm are CNC routed from a smaller drilled hole.

Min. drill diameter for 2- or more-layer PCBs is 0.15 mm (more costly!)

Min. drill diameter for aluminum-core PCBs is 0.65 mm

Min. drill diameter for copper-core PCBs is 1.0 mm

Through-holes: +0.13 / -0.08 mm

Press-fit holes：±0.05 mm (Finished hole size: 0.55-2.0mm. Multilayer ENIG boards and circular holes only. Mention the specific holes in PCB Remark)

e.g. for the 0.6mm hole size, the finished hole size between 0.52mm to 0.73mm is acceptable.

To avoid soldermask or tin stuck in the hole, recommended PTH size≥0.5mm.

1-layer (NPTH only): 0.3 mm hole size / 0.5 mm via diameter

2-layer: 0.15mm hole size / 0.25mm via diameter

Multilayer: 0.15 mm hole size / 0.25 mm via diameter

① Via diameter should be 0.1mm(0.15mm preferred) larger than Via hole size.

② Preferred Min. Via hole size: 0.2mm

③ 0.15mm hole size with any size via diameter, and 0.2mm or 0.25mm hole size with via diameter less than 0.45mm, will cost more.

2-layer: 0.5mm

Multi-layer: 0.35mm

Plated: +0.13 / -0.08 mm

Non-plated: ±0.2mm

Plated slot is made by drill tools.

Non-plated slot is made by CNC.

Castellated holes are metalized half-holes on PCB edges, commonly used on daughter boards to be soldered onto carrier PCBs.

① Hole diameter (Φ): ≥ 0.5 mm

② Hole to board edge (L): ≥ 1 mm

③ Hole to hole (D): ≥ 0.5 mm

④ Min. PCB size：10 × 10 mm

⑤ Min. PCB thickness: 0.6 mm

Plated edges are copper-plated and ENIG treated. HASL is not supported.

① Min. PCB size: 10 × 10 mm

② Min. PCB thickness: 0.6 mm

③ At least 3 breaks (more for larger PCBs) in the edge plating are required for support tab connections

① Blind slot width (W): ≥1.0mm

② Blind slot depth (D): ≥0.2mm

③ Blind slot annular width (A): ≥0.3mm

④ Safety distance (S): ≥0.2mm

⑤ Blind slot remaining thickness (R): ≥0.2mm

⑥ Supports 2-32-layer FR4 boards with a thickness of ≥0.8mm

Backdrill uses a secondary drilling process to control the depth of the hole, removing excess copper from the other layers of the via, thereby reducing its interference with the signal.

①Supports 4-32-layer FR4 boards with a thickness of ≥0.8mm

②Through-Hole Diameter(D): 0.2-0.5mm(Epoxy filled after backdrilling)

③Backdrill Diameter(W): typically 0.2mm larger than through-hole diameter

④Backdrill Depth(L): layers with backdrilling, customizable

⑤Dielectric Thickness(T): ≥0.15mm

⑥Safety Distance(S): ≥0.2mm

1- and 2-layer: 0.10 / 0.10 mm (4 / 4 mil)

Multilayer: 0.09 / 0.09 mm (3.5 / 3.5 mil). 3 mil is acceptable in BGA fan-outs.

2-layer: 0.16 / 0.16 mm (6.5 / 6.5 mil)

Multilayer: 0.15 / 0.15 mm (6 / 6 mil)

2-layer:

1 oz: Recommended 0.25 mm or above; absolute minimum 0.18 mm

2 oz: 0.254 mm or above

Multilayer:

1 oz: Recommended 0.20 mm or above; absolute minimum 0.15 mm

2 oz: 0.254 mm or above

① 0.2mm-0.25mm BGA pad diameter requires ENIG

② BGA pad to trace clearance ≥ 0.1 mm (min. 0.09 mm for multilayer boards)

③ Vias can be placed within BGA pads using filled and plated-over vias

Minimum trace width/clearance: 0.15/0.15mm, when traces are covered by solder mask (1oz).

Minimum trace width/clearance: 0.25/0.25mm, when traces are NOT covered by solder mask (1oz). ENIG only(high risk of short circuit with HASL)

More details of SMD pad spacing: SMD component spacing design support

Minimum SMD pad: 0.25mm × 0.25mm

LDI equipment upgraded in June 2025. Pad size:soldermask opening can be 1:1(Previous production file will be followed in Reorder).

Keep at least 0.09 mm clearance between soldermask openings and neighboring traces.

1oz:

Min. pad spacing: 0.10 mm (green, red, yellow, blue, purple)

Min. pad spacing: 0.13 mm (black, white)

2oz:

Min. pad spacing: 0.20 mm (any color)

Vias are filled with soldermask for an opaque finish. Ask about via covering options

① Filled vias must not have soldermask openings on either side

② Filled vias should have ≥ 0.35 mm clearance from other soldermask openings (e.g. pads)

③ Filled vias must be no wider than 0.5 mm diameter

Epoxy Filled & Capped

Copper paste Filled&Capped

Filled and capped vias can provide a planar surface for pads. Specify the required filling material, via diameter and capping requirements in your fabrication notes.

The suitable process depends on the stackup and application. Do not assume that via filling is included solely because a board has six or more layers. Confirm via treatment with DIYIPCB before ordering.

① Copper clearance from routed board edges: ≧0.2 mm

② Copper clearance from routed slots: ≧0.2 mm

③ Dimension tolerance for routed board edges: ±0.2 mm (regular precision); ±0.1 mm (high precision)

④ Minimum dimension 50*50mm for high precision, and at least 3 tooling holes with minimum 1.5mm diameter on different corners.

⑤ Minimum slot width for aluminum/copper core PCB: 1.6mm.

① Copper clearance from V-cut board edges: ≧0.4 mm

② Dimension tolerance for V-cut board edges: ±0.4 mm. PCB thickness ≥ 0.6 mm

③ Zero panel board spacing by default. Alternatively, V-cut along one direction with no spacing and route along the other direction with 1.6 or 2 mm board spacing.

④ Min. panel dimensions: 70 × 70 mm; max. panel dimensions: 475 × 475 mm

⑤ V-cut groove angle: 25°

⑥Minimum spacing between two v-cuts: 2mm(3mm is recommended)

① Copper clearance from non-mouse-bite board edges: ≧0.2 mm

② Dimension tolerance for non-mouse-bite board edges: ±0.2 mm (regular precision); ±0.1 mm (high precision)

③ Panel board spacing: 1.6 or 2 mm

④ Serrated edges will remain after depanelization

⑤ Minimum tooling edge width: 3 mm. For SMT assembly, confirm the required rail width, tooling holes and fiducial positions with DIYIPCB before releasing the panel design.

⑥ Recommended diameter of mouse bite is 0.5mm-0.8mm; Recommended distance between the two mouse-bites is 0.2-0.3mm. The minimum width of breakaway tab is 4mm. For breakaway with mouse-bites, the minimum width is 5mm.

For supplier-panelized circular boards, confirm the individual board diameter and proposed panel layout with DIYIPCB.

Panelize with stamp holes and add tooling strips on four board edges

Inner/outer layer copper weight: 1/3oz, 0.5oz, and 1oz.

Lamination structures: with coverlay or without coverlay.

For inner layers with 1oz copper weight, coverlay is applied by default to prevent delamination and blistering during lamination.

25µm dielectric thickness FPC:

1-Layer: 0.07 / 0.11 mm

2-Layer: 0.11 / 0.12 / 0.2 mm

50µm dielectric thickness FPC:

1-Layer: 0.12 mm

2-Layer: 0.19 mm

Transparent FPC:

1-Layer: 0.14 mm

2-Layer: 0.24 mm

4-Layer FPC: 0.2 / 0.25 / 0.30 / 0.35 / 0.40 / 0.45 mm

①The thickness of the finished FPC excluding any stiffeners (If the measured area has no copper or coverlay, the finished thickness will be reduced.)

②White coverlay is 10um per side thicker than yellow/black coverlay.

Single-sided: 18 μm (0.5 oz), 35 μm (1 oz)

Double-sided & four-layer: 12 μm (0.33 oz), 18 μm (0.5 oz), 35 μm (1 oz)

1. Area with stiffener thickness ≤ 0.3 mm: ±0.05 mm

2. Area with stiffener thickness between 0.3-1.0 mm (including 1.0 mm): ±0.1 mm

3. Area with stiffener thickness above 1.0 mm: ±10%

4. Gold finger area: ±0.03 mm

Castellated holes are plated half-holes on the edge of an FPC. Most often used for press-soldered connectors.

① Castellated hole diameter: ≥ 0.3 mm

② Castellated hole to board edge: ≥ 0.5 mm

③ Castellated hole to hole: ≥ 0.4 mm

①Regular: 0.3mm/0.55mm

②Extreme for 2-layer: 0.10mm/0.3mm (extra cost required)

③Extreme for 4-layer: 0.15mm/0.35mm (extra cost required)

④Via diameter must be at least 0.2mm larger than via hole size, 0.25mm or above is better.

① 12 μm (0.33 oz) copper: 3/3 mil (absolute limit 2/2 mil – avoid if possible)

② 18 μm (0.5 oz) copper: 3.5/3.5 mil

③ 35 μm (1 oz) copper: 4/4 mil

These are regular capabilities. Contact customer support for custom capability requirements.

① Via ring to trace: ≥ 0.1 mm (more whenever possible)

② Exposed pad to trace: ≥ 0.15 mm (more whenever possible)

① BGA pad diameter: ≥ 0.25 mm

② BGA pad to trace clearance: ≥ 0.2 mm

Coverlay expansion (one-sided): 0.1 mm

Coverlay opening to trace clearance: ≥ 0.15 mm (more whenever possible)

25µm dielectric thickness FPC:

① PI: 12.5μm, Adhesive: 15μm (on 1/3oz or 0.5oz copper)

② PI: 25μm, Adhesive: 25μm (on 1oz copper)

50µm dielectric thickness FPC: PI: 25μm, Adhesive: 25μm

Transparent FPC: PET: 25μm, Adhesive: 25μm

Note: white coverlay is usually 13-18μm thicker per side than yellow or black coverlay.

① Copper to board edge ≥ 0.3mm

② Copper to slots ≥ 0.3mm

③ Outline tolerance: ±0.1 mm (±0.05 mm upon request)

① Spacing between boards is commonly 2 mm. For boards with metal stiffeners use 3 mm instead.

② Handling edges of width 5 mm required on all four sides. Copper pour is required on these edges, with 1 mm clearance around fiducials and 0.5 mm clearance around tooling holes.

③ Fiducials: 1 mm; tooling holes: 2 mm; Fiducial centre to board edge: 3.85 mm. Add four fiducials with one offset by 5 mm or more to aid orientation.

④ Support tab width: 0.7-1.0 mm

⑤ Maximum panel size: 234 × 490 mm

3M9077 (0.05 mm thick; heat-resistant)

3M468 (0.13 mm thick; not heat-resistant)

tesa8854 (0.1mm thick; heat-resistant, good adhesion, recommended)

Single layer: ≥ 6× total thickness

Multi-layer: ≥ 10× total thickness

Static Bending: Smaller radius allowed (typically 6-10× thickness)

Dynamic Bending: Larger radius required (≥ 10-15× thickness recommended)

Static: Bent once or few times during assembly and remains in fixed shape. Suitable for most applications.

Dynamic: Repeated bending (thousands of cycles). Use 1-2 layers + adhesive-less PI for best lifespan. Avoid placing vias/pads in bend area.

Core polyimide εr: 3.3

Coverlay εr: 2.9

Core polyimide thickness: 25 μm / 50 μm

Single PCB Size: 10x10mm – 470x500mm

PCB Panel Size: 10x10mm – 250x250mm

Single PCB Size: 70x70mm – 460x500mm

PCB Panel Size: 70x70mm – 250x250mm

Lead-Free: HASL

Leaded: HASL

Lead-Free: HASL

Leaded: HASL

Lead-Free: HASL

Leaded: HASL

Lead-Free: HASL / ENIG

Leaded: HASL / ENIG

Lead-Free: HASL

Leaded: HASL

Lead-Free: HASL

Leaded: HASL

Lead-Free: HASL

Leaded: HASL

Lead-Free: HASL

Leaded: HASL

Lead-Free: HASL / ENIG

Leaded: HASL / ENIG

Engineering recommendation

Ask DIYIPCB to recommend stencil thickness based on pad geometry and component requirements.

Customer-specified thickness

Include the required thickness in your inquiry. Availability and pricing will be confirmed for the selected process.

Common stencil thicknesses include 0.10 mm, 0.12 mm, 0.15 mm, 0.18 mm and 0.20 mm. Confirm special thicknesses and any associated charges before ordering.

Non-Framework:

Standard size: 280x380mm – 700 × 600 mm

Custom size: You can customize any dimensions within 650*580mm.

Note: Any non-standard sizes, for example, 1:1 as PCB, need to choose custom size and input specific size.

Framework:

Minimum: 400*300 (Valid Area 240mm*140mm)

Square Max: 736 × 736 mm (Valid Area: 500 × 500 mm)

Rectangular Max: 1500 × 500 mm (Valid Area: 1300 × 320 mm)

Note: Valid Area is where the apertures can be open

4 options:

1. Top Only

2. Bottom Only

3. Top + Bottom (On Single Stencil)

4. Top + Bottom (On Separate Stencils)

Get a DIYIPCB stencil quote.

2 options:

1. Solder Paste Stencil

2. Red Glue Stencil

Get a DIYIPCB stencil quote.

3 Options:

1. Sanding

2. Etching Polish

3. Electropolishing (Ideal for ICs ≤ 0.5 mm pitch and BGA packages)

Get a DIYIPCB stencil quote.

3 options:

1. No Fiducial

2. Etched Through

3. Etched Half Into

Get a DIYIPCB stencil quote.

Non-framework:

≤250×250 mm: Packed in a plastic bag with an air-shipping box.

>250×250 mm: Packed in a cardboard box and clamped with wooden boards.

Framework: Packed in a box, then clamped with wooden boards

Fastest build time: 12 hours

Note: The final build time may vary based on the selected stencil specifications and order confirmation time.

If you order a stencil together with PCBs, stencil size within 280mm × 280mm can be shipped together with the PCBs.

However, if you choose express shipping (e.g., DHL, FedEx), stencil size exceeding 280mm × 280mm will be shipped separately.